Institute of Technical Physics and Materials Science (MFA)
Institute of Technical Physics and Materials Science (MFA)

Overview

The main tasks of the Institute of Technical Physics and Materials Science (MFA) are: research on nanometer scale functional materials exploring their physical, chemical and biological properties, as well as the exploitation of these properties in the development of integrated nano/microsystems, sensors, and non-destructive characterisation techniques. Important task of the MFA is the technical support of the SMEs and the university education, the utilisation of the research infrastructure for serving the needs of graduate and postgraduate education (TDK, BSc, MSc, and PhD) in the scheme of an open access laboratory.

MFA hosts 5 scientific departments and 2 groups:

Microtechnology Department (www.mems.hu, www.biomems.hu, www.nems.hu)

The main task of the Microtechnology Department is the multidisciplinary research on sensors, the realisation of functional nano- and microsensors based upon novel sensing principles, their validation and elaboration of the adequate processing technology.

In the… The Institute of Technical Physics and Materials Science (MFA)  Microtechnology Department runs two 300 m2 + 160 m2 clean labs (Class 100-10000) comprising a complete Si-CMOS processing line and a mask shop, unique facility in Hungary. The technology allows to manufacture layers, patterned structures and devices with line resolution of 1 µm by optical and down to 20 nm by e-beam lithography on 3” and 4” Si and glass wafers. (http://www.mems.hu)

Competences (available also for our industrial and academic partners and customers):

High temperature annealing, diffusion and oxidation;
Ion implantation;
Rapid Thermal Treatment;
Low Pressure Chemical Vapor Deposition of poly-Si, SiO2 and Si3N4 layers;
Low Temperature Chemical Vapor Deposition;
Atomic Layer Deposition;
Physical Vapor Deposition – Electron beam evaporation, DC and RF Sputtering;
Reactive Ion Etching, Deep Reactive Ion Etching;
Photolithography with back-side alignment and Nanoimprinting;
E-beam lithography;
Nanopatterning…. Services provided by our laboratories:

High temperature annealing, diffusion and oxidation;
Ion implantation;
Rapid Thermal Treatment;
Low Pressure Chemical Vapor Deposition of poly-Si, SiO2 and Si3N4 layers;
Low Temperature Chemical Vapor Deposition;
Atomic Layer Deposition;
Physical Vapor Deposition – Electron beam evaporation, DC and RF Sputtering;
Reactive Ion Etching, Deep Reactive Ion Etching;
Photolithography with back-side alignment and Nanoimprinting;
E-beam lithography;
Nanopatterning, deposition and etching by Focused Ion-Beam;
Wafer-bonding;
Wet chemical treatments;
Electro-chemical porous Si formation;
Mask design, laser pattern generator;
Polymer (PDMS, SU8, Polyimide) structuring by photolithography and micro-molding techniques;
Chip dicing, packaging especially for sensor applications; 
Materials and structural analysis & characterization:, SEM, FIB, EDX, Atomic Force Microscopy, Electrochemical Impedance Spectroscopy, Stylus Profiler;
Electrical and…. Yes. service.