Institute for Microelectronics and Microsystems (IMM) - Section of Bologna
Institute for Microelectronics and Microsystems (IMM) - Section of Bologna

Italy: Emilia-Romagna

Overview

The Institute for Microelectronics and Microsystems (IMM) of the Italian National Research Council (CNR) is composed of 7 sections, located in Milan, Bologna, Rome, Napoli, Lecce and Catania. The Section of Bologna (IMM-BO) (http://www.bo.imm.cnr.it), whose staff comprises more than 50 people (researchers, technicians, administrative staff), is a multi-disciplinary research center that has been working on the study of materials and devices for microelectronics and MEMS for over 30 years. Thanks to the synergy between physics, engineers and chemistry IMM-BO provides a global and flexible approach to the development of innovative technologies for application specific areas.

The institute can embrace a wide area of knowledge, spanning from material characterization to the study of technological processes and from the design and fabrication of integrated devices to their integration in high TRL systems.

IMM Bologna is equipped with a wide range of facilities for design, manufacture, characterization of… Technological Facilities & Equipments:

Ion Implantation (medium and high energy; different species)
Rapid Thermal Process (RTP) (Lamp; Si and SiC)
Ultra-High Temperature Annealing (RF; Si and SiC)
Furnace Treatments (dry and wet oxidation, annealing and doping)
Low Pressure Chemical Vapour Deposition (LPCVD) (polySi, silicon nitride, TEOS and LTO)
Catalytic Chemical Vapour Deposition (CNT and graphene)
Plasma Enhanced Chemical Vapour Deposition (SiC, a-Si, silicon nitride, doped microcrystalline Si)
Electron Beam Evaporation, Sputter Deposition
Etching Processes with Reactive Ion Etching (RIE) and Deep Reactive Ion Etching
Anisotropic Silicon Wet Etching
Optical and Deep-UV Lithography
Nano-Imprint UV-assisted
Electron Beam Lithography
Focused Ion Beam Etching and Lithography
Wafer Bonding (different types)
Wire Bonding (ultrasonic)
High Precision Dicing Saw. 

Structural Characterization:

Transmission Electron Microscopy (Tecnai F20 TEM/STEM, JEOL ARM200F…. Services and activities under contract are possible at IMM Bologna in the fields of Technological Processes, Structural Characterization and Sensors and Electrical Characterization.

Structural characterization by Electron Microscopy (SEM, TEM) and X-Rays scattering techniques
Design and Simulation
MEMS - Proof of concept fabrication
Customized MEMS sensors small-sale production
Packaging
Metrology and Electrical characterization
Optical characterization
Sensors and Microsystems Characterization
R&D support

The main facilities available and the related services, have been described above and are listed here: https://www.bo.imm.cnr.it/unit/resource-service.
. Yes. service.

Sectors
Aeronautics & space - Automotive - Construction & building sector - Energy - Environment - Electronics - Measurement
Technology
Smart Manufacturing / Industry 4.0 - Process industry (processing of novel materials, structures, etc.) - Intelligent/ sensor-based equipment - Electronic and optical functional materials - Materials for energy storage and generation - Quantum technology - Optoelectronics (optical networks, optical sensors) - Power electronics - Heterogeneous components & more than Moore (MEMS, NEMS, sensors, transducers) - Nanomembranes - Nanoparticles Nanowires and tubes - 2D materials - Photodetectors (solar cells, photo-diodes, photo-transistors) - Optical fibres - Optical communication and networks - Optical components & systems
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